PCB ASSEMBLY CAPABILITIES

DFM (Design For Manufacturing)
Our front end engineering is a unique combination of DFF (design for fabrication) and DFA (design for assembly) in a fast turn around EMS environment.

Running a high tech DFA system allows us to start jobs on time with all parts correct. Our DFA system includes fully automated BOM analysis, Gerber comparison and centroid data analysis. By coordinating these three critical items before assembly starts we assure an on time start and finish. Even details like heel and toe wetting angles is measured in the database DFA.

SMT Line
Our SMT line is a start of the art system that is capable of placing any SMT devices
            0201, 0.4mm BGA, 2.000 ball BGAs, 10 mil pitch QFP
By using precision SMT equipment we minimize or eliminate the need for hand placement and soldering (and associated variations and errors). Strict ISO9001:2008 certified controls and procedures insure consistent results throughout the job and day to day. In-process controls included environmentally controlled screen printing, camera alignment before placement during high speed placement, local fiducial alignment during large component placement, individual profiles for reflow and water monitoring during cleaning.

Flying Probe Electrical Tester
Flying_probe_Takaya_pcb_assembly

5DX X-Ray used on all BGAs
5DX_Xray_Takaya_pcb_assembly

Full Shop ERP Controls
ERP_pcb_assembly

ROHS Compliant Processing
ROHS_pcb_assembly
Automated Optical Inspection       
AOI_pcb_assembly       
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